Fill-LM Series
Techinno Fill-LM is a series of liquid composite made of liquid metal, polymer and thermally conductive fillers. It is used for the high power components to improve the reliability by providing extremely low thermal resistance. Liquid metal composite can fulfill the gaps and uneven surface of the interface, to form better contact and enhance the thermal conductive efficiency. Fill-LM series products have good thixotropy and easy to be printed on the bare die or heat sink. Techinno Fill-LM products improved the disadvantages of pure liquid metal such as easy to flow, high surface tension, inherent corrosion to metal through bi-continuous liquid metal and polymer phases.
Features
High thermal performance, extremely low
thermal impedance
Good thixotropy，not flowable to avoid short circuit
Good wetting capability on Si or copper substrate
Good for printing process
High reliability
No pump out/dry out，no crack/slump
Typical Application
CPU，GPU chips
High power bare die processor
High end consumer electronics
Game console
Storage and Shelf Life
| Sealed and Stored under the condition of 15-35℃，≤65%RH |
The shelf life is 12 months after packing |
Ordering Information
| The sheet material can be costomized according to customer requirements.(Fusion point, thickness, cut shapes and other specific parameters.) |
The paste material can be provided in tanks of 20g，120g and 500g. |
Property
