Techinno Fill-GelXXX is a family of paste-like material which is mixed with thermally conductive ceramic powder and silicone gel. These products are fully cured dispensable gels,requiring no mixing or curing. Fill-Gels have high thixotropy and flexibility. It is an ideal type of material for filling gaps of different heights under lower pressure, and suitable for the scene where multiple heating components share one heat sink. 
They are specially formulated for applications demanding low stress to protect sensitive electronic components. The cross-linked gel structure provides superior long term reliability over conventional greases in harsh temperature cycling and shock & vibration. The Fill-Gels can be applied by automatic dispensing with high dispense rate for improved productivity, reducing customer manufacturing, purchasing and instal lation cost.