Fill-Pad Ultra Soft Series
Techinno Fill-Pad US Series thermal conductive pad products are made of resin and thermal conductive fillers. The products have good surface wetting, flexibility and high compressibility properties. This series of Fill-Pads have good compression performance and ultra-low installation stress, which can avoid damage to the chip, PCB and other components by the installation stress, and are suitable for occasions with strict installation requirements.
The thermal pads are naturally tacky and require no additional adhe sive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
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Features
Good surface wetting property
Flexible，high compressibility for low stress applications
Low oil bleeding
Good handling
Easy to rework
Excellent reliability
Typical Application
Telecommunications，wireless
Industry，LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Optical modules
Storage and Shelf Life
| Storage under the condition of 0-35℃，≤65%RH | The shelf life is 12 months after packing |
Ordering Information
| Thickness Tolerance: >=1mm，±10%; 0.5-1mm，±0.1mm | The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
Property
