Fill-Pad Low Volatility Series
Techinno Fill-Pad LV Series thermal conductive pad products are made of unique formulation and special process, which have low volatility, little small molecular content, good thermal conductivity and surface wetting properties. The products are used between the heating power device and the heat sink which can effectively exclude the air, reduce the contact thermal resistance, and avoid volatiles contamination of the application surrounding.
The thermal pads are naturally tacky and require no additional adhe sive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
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Features
Low outgassing, D3-D10 (< 100ppm)
Good surface wetting property
Low compression force
High compressibility
High flexibility
Naturally tacky or available with tack-free in one side
Typical Application
Telecommunications，wireless
LCD, PDP, and Laser TV Monitor
Industry，LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Storage and Shelf Life
| Storage under the condition of 0-35℃，≤65%RH | The shelf life is 12 months after packing |
Ordering Information
| Thickness Tolerance: >=1mm，±10%; 0.5-1mm，±0.1mm | The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
Property
