Fill-Grease Series

Techinno Fill-Grease series products have high thermal conductivity, low viscosity and good thixotropy. They can be applied on the substrate smoothly by stencil printing, screen printing or dispensing. Furthermore, they can wet the contact surface very well even under low mounting stress. Excellent wetting property and low bond line thickness enable it minimize the contact thermal resistance. Fill-Grease series products containing silicone and silicone-free types have outstanding reliability and meet the requirements of various application environments. Fill-Grease series products are designed with different thermal performance to meet different power density in real applications. Products with different BLT are also available to meet different interface flatness and various application scenarios.

Features

Low viscosity and good thixotropy for dispensing,screen printing and stencil printing

Multiple bondline thickness for different applications

Broad range of thermal performance options for
 different power density

Suitable for sensitive electronic components

Excellent reliability

Storage at room temperature,good stability

Typical Application

CPU,GPU chips

IGBT modules & Power units

Automotive electronics

North bridge chips

Customized ASICS chips

Storage and Shelf Life

Storage under the condition of 20-35℃,≤65%RH The shelf life is 12 months after packing

Ordering Information

The products can be provided in 30cc cartridge,1kg jar,300cc aluminum tube and 5gallon pail

Property