Fill-Pad Insulation Series
Techinno Fill-Pad Insulation Series thermal conductive pad products are insulator-silicone composite or PI film-silicone composite made by special formulation.The products have good surface wetting capability minimizes the interface thermal impedance. Fill-Pad Insulation Series products provide high insulation, good resistant to tear, cut-through, puncture and abrasion performance.
The thermal pads are naturally tacky and require no additional adhe sive for mating. Also single side adhesive or single side non-tacky surface treatment are available for special application.
Related Products
Features
High Insulation
Good resistant to tear, cut-through and puncture
Good surface wetting property
Low compression force，High compressibility
Typical Application
Telecommunications，wireless
LCD, PDP, and Laser TV Monitor
Industry，LED lighting and power modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Intelligent terminal
Storage and Shelf Life
| Storage under the condition of 0-35℃，≤65%RH | The shelf life is 12 months after packing |
Ordering Information
| Thickness Tolerance: >=1mm，±10%; 0.5-1mm，±0.1mm | The thickness can be customized according to requirement. Please inquire the available thickness before ordering. |
Property
