Fill-Hybrid Series

Techinno Fill-Hybrid Series products provide fast heat transfer while absorbing electromagnetic waves, thus reducing or eliminating electromagnetic interference and meeting the design requirements for miniaturised and ultra-thin equipment. These products have good thermal conductivity and good workability and can be quickly extruded for automatic dispensing operations with high efficiency and excellent reliability. They can be applied at low pressure to fill gaps at different heights or to protect sensitive electronic components in electronic assemblies that are used in small spaces and require low mechanical stress.

Features

High thermal conductivity

Excellent wave absorption, high magnetic loss

Reduce reflection in transmission

High reliability

Typical Application

ICs, heat sinks, chassis or related thermal modules

RF Applications

Smart terminals, mobile phones, tablets

Communication devices

Storage and Shelf Life

Sealed and storage under the condition of 0~35℃&≤65%RH

Shelf life is 6 months after packing

Ordering Information

Fill-Hybrid Series can be provided in cartridge of 30cc, 300cc, and 5 gallon pail

Property