Since Fill-Pad SF800 was released in August, it has attracted wide attention as soon as it was released due to its series of advantages such as low oil seepage, low volatility, no silicon pollution, electrical insulation, high thermal conductivity, and so on. Many customers of projectors, camera modules, high-end industrial control, and medical electronics and storage drives have called to ask for sample products, and consistently give high praise to the test results. SSD flash customers hope to further improve the thermal conductivity.

Recently, after the hard work of Techinno researchers, the thermal conductivity of Fill-Pad SF800 is further improved to 10W/m-K based on 8W/m-K high thermal conductivity. This is Fill-Pad SF1000 we are going to introduce today.

Fill-Pad SF1000 inherits the comprehensive advantages of Fill-Pad SF800, but with higher thermal conductivity. It can better meet the requirements of high power and high heat flux electronic products for heat dissipation. Now let's take a look at the performance indicators of Fill-Pad SF1000:

Volatility Test

①TML test

After cutting into the required size, the sample shall be placed in a vacuum oven at 125℃ and baked for 24h. The overall mass loss percentage of the products shall be calculated by the weight before and after the experiment. The volatility rate of Fill-Pad SF1000 is 0.16%.

②Volatile oil film test

A certain amount of samples are put into a metal crucible and placed in a flat bottomed glass bottle with a surface dish covering the mouth of the bottle. Heat the bottom of the glass bottle at 125℃ for 72h and observe whether there is an oil film on the surface dish. Experimental results show that there is no oil film on Fill-Pad SF1000.

Oil Seepage Test

①Oil seepage performance test: weight loss test method

The sample shall be cut into specified size, with glass fiber cloth on top and bottom respectively, and then shall be put on filter paper and put into the fixture, which can be shown in Fig. 5. Maintaining 50% compression deformation, the samples shall be placed in an oven at 125℃ for 48h to calculate oil seepage weight loss. Experimental results show that the oil seepage of Fill-Pad SF1000 of TECHINNO product is 0.65%.

Fig. 5. Diagram of weight loss test method

②Oil seepage performance test: area test method

The sample shall be put on clean A4 white paper covered by PI film, and be placed on aluminum plate with 1kg weight pressure. After baking at 125℃ for 48h, the sample shall be taken out and measured the maximum distance among the oil ring on the white paper and the four sides of the sample. Experimental results show that the maximum oil seepage boundary of Fill-Pad SF1000 of TECHINNO product is 4mm.

实验前  Before          实验后 After

Fig. 6. Diagram of area test method

Mechanical Performance Test

The hardness of this product is Shore00 60, and the overall compressive stress is small. Even if the overpressure reaches 70%, the stress will relax quickly, but the residual stress will always exist, which ensures good contact with the interface when encountering external interference or thermal expansion and contraction of temperature cycle, and always maintains a relatively low interface thermal resistance and excellent reliability.

Fig. 1. Diagram of mechanical performance test

Fig. 2. SF1000 Instantaneous stress-deformation curve in 0.25mm/min

Themal Resistance Test

According to the standard of ASTM D5470, the thermal resistance tester(LW-9389, Ruiling, Taiwan, China) is used, and the thermal resistance of the test gap pad varies with pressure is shown in Fig.3. The result shows that the overall thermal resistance of the product is low, especially under 20PSI pressure.

Fig. 3. The thermal resistance of SF1000 under pressure from 10psi to 70psi.

Fig. 4. Diagram of thermal resistance tester.

Volume Resistivity

Prepare a 100*100*1.0mm sample, place it in the center of the electrode of the volume resistivity test box, and close the cover of the test box to test. The average volume resistivity of Fill-Pad SF1000 is 2.3*10^14 Ω.cm.

Electric Insulation Strength Test

Prepare a 100*100*1.0 mm sample, and the average insulation strength of Fill-Pad SF1000 is 7.81kV/cm for the test as shown in the figure below.

Product Features

• Thermal conductivity at 10 W/m-K
• Good surface wettability and high compressibility
• Non-silicon system, no silicon pollution
• Low oil seepage and low volatility
• High electrical insulation

Typical Applications

• 5G communication base stations, wireless infrastructure, and optical modules
• LCD, PDP and laser TV displays
• Camera module, optical precision equipment
• Projector and OA office electronic products
• Industrial, LED lighting and power modules
•  Hard disk drives and solid-state disk storage devices
• High-end industrial control and medical electronics and other fields

Technical Parameters

Ordering Information

Standard size of 457x457, thickness nominal value of ±10% (≥1mm);

Nominal value of ±0.1mm (<1 mm). Size and thickness can be customized according to customer needs. Please inquire about available thickness before ordering.