New energy vehicles are entering the HPC era, the huge heat caused by high power puts more stringent requirements on heat dissipation. Especially for the new energy automotive electronic components with increasing integration, under the several waves of intelligence, electrification, networking, and multi-screen, small heating components such as inductors, copper bars, and capacitors have changed in terms of order of magnitude and calorific value.

In the process of centralization of each control unit of new energy vehicle, the peak of its internal power density has already exceeded kilowatt. In order to ensure that the circuit is stable and smooth, the large number of heating components on the circuit board has an urgent need for high-performance thermal management solutions.

Therefore, through high thermal conductivity materials to improve thermal conductivity efficiency, help these heating components better thermal management, while maintaining good mechanical strength and flexibility of the material to ensure reliability and process friendliness, has become a "must answer" on the road to the development of new energy vehicles.

Thermal Design Requirements:

1. Thin film capacitors are easily damaged, requiring thermal conductive materials with performances of low stress, excellent mechanical properties, high strength and good toughness
2. Low oil bleeding, high insulation, avoid contaminating of the surrounding circuits or affecting the electronic path
3. The working environment of vehicle vibration requires high reliability, and the material needs good resilience

To meet the heat dissipation requirements of automotive electronic heating components in high power density environment, Techinno developed a thermal conductive gasket Fill-Pad US550 with excellent performance, moderate soft and hard and good resilience.

Techinno Fill-Pad US550

Techinno Fill-Pad US550 is a high performance gap filler material which combines 5.5W/m-K thermal conductivity with high resilience. The unique formula design enables it to maintain good mechanical strength, has the tension and bending resistance, has good surface wetting property to minimize interface thermal resistance, and has good handling, can be well applied in various working conditions and ensure its integrity. The product has excellent mechanical properties and extremely low oil bleeding while having high thermal conductivity, which can effectively protect electronic devices from damage and pollution in applications. It’s especially suitable for the automobile industry.

The standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications. It can also be coated on one side of PI film to enhance electrical insulation.

Features

1. High thermal conductivity: 5.5 W/m-K
2. Good mechanical properties, high resilience, tension and bending resistance
3. High breakdown voltage, excellent electrical insulation performance
4. Low oil bleeding
5. Naturally tacky or tack-free on one side available
6. Good surface wetting property
7. High compressibility under low pressure

Typical Applications

1. Automotive electronics and power batteries
2. Electronic control unit, domain controller
3. Capacitor, inductor, power module
4. Telecommunications, wireless infrastructure & network servers
5. LCD, PDP and Laser TV displays
6. Industrial, LED lighting
7. Hard disk drives and solid hard disk memory devices

Mechanical Performance Testing

The Fill-Pad US550 has excellent mechanical performance. It has good strength, and not easy to break by tensile testing; After completely bending around the cylinder, there is no crack or damage at the crease; Applying a certain external force to it, then remove the external force, the product shows obvious resilience.

Oil Bleeding Testing

After baking at 125℃ for 48 hours, the maximum oil ring of the Fill-Pad US550 is only 0.5mm, which effectively protects the circuit from contamination.

Insulation Testing

Fill-Pad US550 meets the requirements of high insulation in circuit board applications, the high breakdown voltage and volume resistivity do not affect the electronic path.

Reliability Testing

Fill-Pad US550 has stable thermal resistance performance throughout the reliability testing, and Fill-Pad US550 can maintain its initial thermal performance under High temperature aging test, Thermal Shock test and HAST test, and there is no sign of a decline in thermal conductivity.

With the support of large computing power, the development of HPC chips is leading the further integration of automotive electronics, each electronic component will undertake more work. How to deal with the huge heat generated by high power density may be one of the most urgent problems on the road to the integration of automotive electronics in the future.

Techinno has developed a series of insulation gap pads with high thermal conductivity and strong mechanical properties specially for automotive electronics, such as Fill-Pad US550. In the environment of vibration and large temperature fluctuations, its excellent resilience ensures that heat can be quickly and effectively conducted, and improves the reliability of products. In addition, Techinno can provide more high performance thermal interface materials to provide high performance solutions for automotive electronic thermal management.