As a key pioneering field of smart vehicles, the intelligent cockpit has evolved with the integration of automotive electronic and electrical architecture, and gradually formed the cockpit domain controller program, where the control and computing of software and hardware are concentrated on the same SoC chip. The single chip is integrated with various modules such as CPU, GPU, RAM, ADC/DAC, Modem, high-speed DSP, and is capable of supporting high-performance computing, graphical computing, Al computing, audio processing and etc.

The high concentration of computing makes the heat generation of  chip become larger, while the hardware integration also leads to further optimization and upgrading of the domain control structure, resulting in a shrinking space for the thermal conduction, with gaps as low as 0.2mm or below. In this context,  phase change materials, which have high thermal conductivity, high reliability, low BLT, better adaptation to the ultra-low interface of the thermal conductivity, are gradually coming into the view and becoming a new application direction.

Techinno Phase Change Material

Fill-PCM 800

Fill-PCM800 is a high performance thermal phase change material and the thermal conductivity is 8.0W/m-K . Its soft property at room temperature makes the product good for application and reworkability. Fill-PCM800 is designed to meet the demanding requirements of today's high performance electronic equipments for heat dissipation, which provides superior reliability and maintains low thermal impedance. Fill-PCM800 can be supplied as cut parts in rolls, sheets or other customized shapes. Techinno also offers printable version Fill-PCM800SP in order to meet various application needs of customers.

Features

◆ Extremely low thermal resistance

◆ Silicone free, no silicone contamination 

◆ Sheet products have natural tacky, stick on the surface of heat sink directly, no additional adhesive

◆ Paste-like products have a low viscosity, easy to print

◆ High reliability, no pump out/dry out/crack/slump in long term application

◆ Good handling and reworkability

◆ Soft at room temperature

Typical Applications

◆ CPU, GPU, and other chipset 

◆ IGBT Module

◆ Memory Modules

◆ Consumer Electronics

◆ Automotive

◆ TV, game console, etc

Thermal Resistance Test

PCM800 can achieve low BLT under low pressure, ultra-low BLT brings lower interfacial thermal resistance, so PCM800 can achieve lower thermal resistance under low pressure, improve the efficiency of thermal conductivity. Especially compared to other silicone grease, PCM800 is more suitable for high power environment of ultra-thin interface thermal conductivity applications.

Reliability Test

No cracking and drooping of PCM800 after 1000 times -40~85℃ thermal shock under vertical conditions

The thermal resistance of Fill-PCM 800 is stable throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-PCM 800 is able to maintain its initial thermal performance without any sign of thermal conductivity decline. During the 1000 times of thermal shock test at -40~125°C, the silicone grease was obviously pumped out, while Fill-PCM 800 was still evenly spread over the entire interface without any "hot spots".

Compared with traditional silicone grease, Fill-PCM 800 has greater molecular cohesion, so even if the interface deforms or “squeezed” after being heated , it still maintains its integrity and is not easy to be damaged by external forces, fully filling the interface gaps to ensure good reliability.

As the degree of intelligence of new energy vehicles continues to improve, the intelligent cockpit is gradually moving towards the final form of the “third living space”. Personalization needs continue to grow, and comparing to factors such as seat comfort, spaciousness, design aesthetics, and quality of parts and components, the interactive experience of a more technological cockpit is more appealing to consumers, which can not leave the improvement of chip computing power.

From the current mainstream hardware structure, two-component gel is still a common thermal conductive material for automotive MCU chips. But with the domain controller “integration, lightweight, miniaturization” trend, reserved for the SoC chip thermal space is decreasing, although two-component gel BLT has been able to achieve 0.5 millimeters or less, but it's still not enough for an ultra-thin interface of less than 0.2 millimeters. On the other side, considering the shortcomings in the reliability of silicone grease, high thermal conductivity phase change materials may be a better choice for intelligent automotive domain control chips in the future. At present, Techinno provides Fill-PCM 800 and Fill-PCM 900 as solutions.