As AI large models evolve toward greater depth and scale, computing power demand is exploding exponentially, placing immense pressure on optical interconnect technologies in traditional cloud data centers. With the accelerated large-scale commercialization of 1.6T optical modules and the impending launch of 3.2T and higher-rate products, high-speed optical modules are becoming the core support for ultra-high bandwidth, ultra-low power consumption, and high-density interconnection in AI computing power clusters.

Thermal Management Challenges of Optical Modules

Behind technological iteration lies an increasingly severe thermal management challenge. With the continuous breakthrough in optical module power and the rising deployment density in data centers, multiple contradictions coexist: high power, compact space, high reliability, and pluggability. Innovative solutions such as liquid cooling and new thermal materials have become critical approaches to solving this dilemma.

In liquid cooling systems, the contact interface between the cold plate and the optical module directly determines heat dissipation efficiency. The external shell of the optical module contacts the cage, and dry contact results in high interfacial thermal resistance, impairing overall heat dissipation performance. Conventional thermal materials are prone to abrasion, scraping, and even failure during repeated plugging and unplugging of optical modules, disrupting the original thermal conduction path. Thus, traditional solutions fail to meet the application requirements of high heat flux density and high-frequency plugging scenarios.

Techinno Precisely Solves Heat Dissipation Issues for Pluggable Optical Module

Techinno has newly launched T-Plug 820S, made for external thermal management of optical modules. This product addresses industry pain points through innovative design, clearing a key obstacle for the large-scale deployment of high-speed optical modules.

Techinno T-Plug 820S | Engineered for Optical Module ThermalManagement

Featuring a metal film substrate and high-performance thermal silicone pad, Techinno T-Plug 820S can be directly attached to the plug-in surface of optical modules. It significantly reduces interfacial thermal resistance to boost heat dissipation efficiency while delivering exceptional plug-in resistance, greatly extending the plugging and unplugging cycles of optical modules, striking a perfect balance between heat dissipation efficiency and operational reliability.

Core Advantage 1: Effectively Reduces Interfacial Thermal Resistance
As the core of optical module thermal management, interfacial thermal resistance directly dictates heat dissipation performance. Techinno T-Plug 820S minimizes the thermal resistance between the optical cage and the optical module shell, accelerating heat transfer to the cold plate and ensuring the stable operation of high-power optical modules.

As pressure increases, T-Plug 820S compresses and thins continuously, with a marked reduction in thermal resistance.

Core Advantage 2: Outstanding Plug-In and Abrasion Resistance

Targeting the vulnerability of thermal materials to damage from repeated optical module plugging, T-Plug 820S has undergone targeted optimization, boasting superior plug-in and abrasion resistance.

Verified by experiments, the product withstands over 2,000 repeated plugging cycles. Despite visible friction marks on the sample surface after testing, no breakage or delamination occurs, maintaining stable performance.

After more than 2,000 cycle tests, obvious friction marks are visible on the T-Plug 820S sample surface, with no structural damage.

Core Advantage 3: Excellent Reliability

Optical modules operate in complex data center environments, imposing stringent requirements on the reliability of thermal materials. Techinno T-Plug 820S has passed rigorous multi-dimensional tests, demonstrating outstanding reliability.

Thermal Resistance Stability: After aging tests under harsh conditions including high temperature, 85/85 test, and thermal shock, the change rate of thermal resistance relative to the initial value is within 10%, ensuring consistent performance.

Oil Bleeding Test: The built-in silicone pad of T-Plug 820S shows no oil bleeding beyond the product boundary at 80℃ and 25℃, featuring excellent low oil bleeding performance and eliminating the risk of interface contamination.

Volatile Oil Film Test: No condensation or fogging is observed in the volatile oil film test at 125℃ for 72 hours, guaranteeing the long-term stable operation of optical modules.

Upgraded Plug-In Resistant Thermal Solution

The traditional PI+PCM structure is a common plug-in resistant thermal solution in the market. We have achieved critical upgrades on this mature structure: replacing PI film with stainless steel film and PCM phase change material with thermal silicone pad, fundamentally eliminating the risk of PCM phase change overflow and leakage under plugging conditions.

PCM poses a significant leakage risk during phase transition, while the thermal silicone pad composite in Teginno T-Plug 820S remains solid at all times, free of leakage hazards. Test results show that the upgraded product retains comparable thermal resistance while achieving a substantial improvement in reliability.

Stainless steel film offers distinct advantages over PI film in plug-in scenarios: enhanced abrasion resistance and extended service life.

In summary, the optimization preserves thermal resistance performance, eliminates leakage risks, and greatly improves reliability and abrasion resistance. Teginno T-Plug 820S provides a more stable and reliable thermal management solution for high-frequency plugging applications.

Conclusion

Techinno Pluggable TIM T-Plug 820S  is designed specifically for thermal interface filling between optical module housings and liquid cooling interfaces, improving thermal conduction efficiency and plugging durability, supporting the large-scale deployment of high-speed optical modules in AI data centers.

Meanwhile, for internal thermal management needs of optical modules, we recommend Techinno one-component post-curing thermal gel Fill-CIP 1120, featuring high reliability, low oil bleeding, and low volatility, providing you with an integrated thermal management solution for both internal and external scenarios of optical modules.

For more product details or sample requests, please contact us via private message or visit the Techinno official website for exclusive services.