On October 29, 2025, the 2025 (4th) Global Conference on Innovation, Development and Application Technology of Liquid Cooling Systems for Data Centers grandly kicked off in Hangzhou. As a highly influential technical exchange platform in the industry, this conference brings together renowned experts, representatives of pioneering enterprises and top research institutions in the industry, focusing on core topics such as liquid cooling technology innovation and breakthroughs in chip-level heat dissipation, to jointly discuss the efficient development path of data centers in the era of computing power. Techinno was invited to attend the conference and won the "2025 Golden Scale Award - Liquid Cooling Materials Innovation Award", becoming one of the highlights of the conference that attracted much attention.

Won the 2025 Golden Scale Award for Liquid Cooling Materials Innovation

At the award ceremony held concurrently with the conference, Techinno successfully won the "2025 Golden Scale Award - Liquid Cooling Materials Innovation Award" for its outstanding technical strength and practical achievements in the field of data center thermal management. This award is not only a high recognition of our continuous innovation capabilities, It further highlights the outstanding value and exemplary effect of Techinno's data center thermal management solution in practical applications.

Techinno made a brilliant appearance with its solutions

At the main forum of the conference, Dr. Zhao, the chief scientist of Techinno, delivered a keynote speech, deeply interpreting the high-performance thermal management solution for immersion liquid cooling in data centers, precisely addressing the heat dissipation pain points in the context of explosive computing power, and providing practical and feasible ideas for the industry.

Tegino provides high-performance thermal conductive solutions with excellent compatibility for liquid-cooled servers such as cold plate type and immersion type in data centers, as well as various equipment including switches and optical modules.

AI Server Chip
Cold plate liquid cooling
Thermal phase change material Fill-PCM 800
Ultra-thin thermal interface material ffill -TPM 800
Immersion liquid cooling
Liquid metal and its composites Fill-LM SP8000
Liquid metal and its composites Fill-LM SP5000

Switch Motherboard
Motherboard video memory, capacitors and inductors, power management chip
Thermal conductive gasket Super Soft Series (Thermal conductivity :12-14W/m-K)
Thermal conductive gel gasket (thermal conductivity :3.5-12.0W/m-K)

Switch
Thermal conductive pad Super Soft series Fill-Pad US1400

Optical Module
Outside the module: Plug-in resistant thermal conductive composite material T-Plug 800S
Within the module: One-component post-curing thermal conductive gel Fill-CIP 1120

In the face of the continuous explosion of global computing power demand, thermal management, as a core link for the stable operation of computing power infrastructure, technological innovation and industrial upgrading have become the key to the development of the industry.

Techinno will continue to increase its investment in research and development in the future, constantly optimize the compatibility of product performance and solutions, and provide more efficient and reliable thermal management solutions for fields such as data centers, new energy vehicles, and consumer electronics. We look forward to working hand in hand with partners from all industries to jointly promote the development of liquid cooling technology and contribute to the sustainable development of the global digital economy.