Driven by rapid AI iteration and surging computing power, data centers enter a high power density era. Highly integrated onboard hardware squeezes CPUs, GPUs, optical modules and other core parts into limited space, bringing great challenges to thermal management. 

1. Extreme local heat flux. Dense high-power chips cause accumulated heat, leading to frequency reduction and system downtime.

2. High interfacial thermal resistance. Micro gaps between components form air barriers and weaken heat dissipation. 

3. Hidden reliability risks. Precision parts are vulnerable to pressure damage. Thermal materials need low outgassing, silicone-free property and stable performance under high temperature.

Techinno Fill-Pad US1600 Silicone-free Thermal Pad

Techinno officially launches the Fill-Pad US 1600 high-performance silicone-free thermal pad, which is tailor-made to address the above industry pain points.

Featuring 16W/m·K ultra-high thermal conductivity, low-stress conformal fitting and silicone-free formulation, this product comprehensively solves core thermal management challenges for high-density AI hardware.

1. 16W/m·K High Thermal Conductivity

Techinno Fill-Pad US1600 is a high-performance gap pad featuring a thermal conductivity of 16.0 W/m-K. Optimized for high-heat-demand scenarios in AI data centers.

Test data shows that higher mounting pressure enables better conformal contact, greatly lowering interfacial thermal resistance and boosting heat dissipation efficiency. Offered in diverse thickness options, it can be flexibly selected to fit various assembly gaps.

2. Good surface wetting property & Low-stress

With ultra-soft texture and superior wettability, Techinno Fill-Pad US1600 closely fits uneven surfaces and fills microscopic gaps to compensate for assembly tolerances, lowering interfacial thermal resistance and enhancing device operational stability.

It provides the right amount of residual stress to maintain a good adhesion to the interface and ensures life cycle reliabilit.

3. Silicone-free

Crafted with silicone-free formula, it avoids siloxane emission and contamination, ideal for sensitive precision electronics.

It sustains steady thermal performance under Isothermal bake @150°C, Thermal shock from -55-125°C and HAST @85°C/85% RH, ensuring reliable long-term heat dissipation.

If you are facing board-level heat dissipation bottlenecks in data center deployment, welcome to contact our team for sample evaluation and professional technical support.