VR Thermal Conductivity Solution
Techinno Solution: Fill-Pad US800
The high degree of integration of electronic components inside VR equipment and space constraints require thermal conductive materials with long-term reliability, vibration resistance, low volatility, low oil penetration, low density and other characteristics. Techinno recommends Fill-Pad US800 as a solution.
Feature
Thermal Conductivity：8.0W/m-K
Good surface wetting property
Low compression force
High compressibility
Low oil bleeding
Low outgassing, D3-D10 (< 100ppm)
Typical Applications
Telecommunications, wireless infrastructure & network servers
Optical modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Industry, LED lighting and power modules
Detailed Explanation of Materials
Thermal Performance of Fill-Pad US800
Techinno Fill-Pad US800 has good thermal properties, a soft surface, and a high amount of deformation at lower pressures to fill interface gaps and compensate for design tolerances.
Oil bleeding test of Fill-Pad US800
The Fill-Pad US800's excellent low oil permeation characteristics effectively prevent contamination of the device after long-term operation, avoiding short-circuit situations that may occur as a result.
Reliability of Fill-Pad US800
Fill-Pad US800 has a stable thermal resistance throughout the aging test. Fill-Pad US800 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST,Fill-Pad US800 can maintain its initial thermal performance without any sign of thermal conductivity decline.
