Laser Thermal Conductivity Solution
Techinno Solution:Fill-PCM 550SP
Fill-PCM 550SP has high thermal conductivity and low viscosity, which makes it easy to construct and dissipate heat from the pump source.
Feature
High thermal conductivity and extremely low thermal resistance
Silicone free, no silicone contamination
Natural tacky, stick on the surface of heat sink directly, no additional adhesive
High reliability, no pump out/dry out/crack/slump in long term application
Good handling and reworkability
Soft at room temperature, less stress on board during assembly
Typical Applications
Laser Pump Sources
Notebooks, Desktops
Graphic processing chips
Memory Modules
Consumer electronics such as TVs, game consoles, etc.
Automotive
Detailed Explanation of Materials
Thermal Performance of Fill-PCM 550SP
Fill-PCM 550SP has a very low viscosity in the molten state, so low BLT can be achieved very quickly at very low pressures, and the very low BLT brings lower thermal resistance, so Fill-PCM 550SP can achieve low thermal resistance at low pressures, and improve the efficiency of thermal conductivity.
Reliability of Fill-PCM 550SP
Fill-PCM 550SP has a stable thermal resistance throughout the aging test. Fill-PCM 550SP has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-PCM 550SP can maintain its initial thermal performance without any sign of thermal conductivity decline.
Droop and IGBT Test of Fill-PCM 550SP
Fill-PCM 550SP has not cracked or slipped after 1,000 cycles of temperature cycling from -40℃ to 85℃ under vertical conditions, and no obvious "hot spots" were seen after 1,000 cycles of thermal cycling under conditions of -40~125℃ using IGBT modules.
