Optical Module Thermal Conductivity Solution
Techinno Solution:Fill-Pad SF1000
Techinno recommends the high-performance non-silicone thermal conductive pad Fill-Pad SF1000 to solve the problem of optical module's sensitivity to volatiles, in order to avoid the precipitation of silicone oil inside the pad under long-term working environment.
Feature
Thermal conductivity 10.0W/m-K
Good surface wetting
Non-silicone system, no silicone contamination
Low oil bleeding
Low volatility
Typical Applications
5G communication base stations, wireless infrastructure, optical modules
LCD, PDP and Laser TV displays
Idustrial, LED lighting and power modules
Camera Module
Hard disk drives and solid state disk storage (SSD)
Detailed Explanation of Materials
Thermal Performance of Fill-Pad SF1000
Fill-Pad SF1000 has good thermal properties and low thermal resistance at low pressure. The soft surface and good wettability of the pad can fill the interfacial gap under certain pressure and transfer the heat out quickly.
Applicability of FiII-Pad SF1000
Fill-Pad SF1000 is a high-performance non-silicone gap pad with low volatility, low oil bleeding, and no silicone small molecules, which makes it especially suitable for electronic components such as optical modules that are sensitive to silicone volatilization. In addition, Fill-Pad SF1000 has good compressibility under low pressure to protect chips during operation.
Reliability of FiII-Pad SF1000
Fill-Pad SF1000 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-Pad SF1000 can maintain its initial thermal performance without any sign of thermal conductivity decline.
