Smart Car Domain Controller Thermal Conductivity Solution
Techinno Solution:Fill-CIP 2100
The power of automotive HPC chips is increasing from 105W to 180W, 250W, and even more than 280W, and the gap with the heat sink is also optimized from 0.4mm~1mm to 0.2mm. Considering the vibration and vertical reliability, low BLT and high thermal conductivity gel is still the most suitable thermal conductivity interface material solution. Fill-CIP 2100 was developed for this high power density application environment.
Feature
Thermal Conductivity：10.0W/m-K
Easy for auto-dispensing
Good surface wetting
Good thixotropic
High compressibility
for low stress applications
Excellent slump resistance and high shear thinning characteristics，Good long-term reliability
Typical Applications
Automotive electronics and battery
Industry，LED lighting and power modules
Large storage data center
Smart phone and consumer electronics
Telecommunications equipments
Power electronics
Detailed Explanation of Materials
Thermal Performance of Fill-CIP 2100
Fill-CIP2100 has excellent thermal conductivity performance, the average value of thermal conductivity test is more than 10.0WmK, it has high thixotropy before curing, and low BLT can be achieved under low pressure, which in turn brings lower thermal resistance and improves thermal conductivity efficiency.
Flow rate of Fill-CIP 2100
Fill-CIP 2100 has good wettability, shear thinning characteristics and high thixotropy, with a flow rate of about 45g/min (30ccEFD2.5mm orifice diameter, 90psi&60s), which is suitable for efficient production in the automotive industry.
Reliability of Fill-CIP 2100
Fill-CIP 2100 has a stable thermal resistance throughout the aging test. Fill-CIP 2100 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-CIP 2100 can maintain its initial thermal performance without any sign of thermal conductivity decline.
