ECC Thermal Conductivity Solution
Techinno Solution:Fill-Pad P311
During the assembly of MOSFET tubes, the gasket adhesive layer is highly susceptible to damage during quick installation of screws, resulting in breakdown on the screws, reducing the reliability and stability of the material. Techinno offers a tailor-made thermal conductivity solution with the highly insulating thermal conductivity spacer Fill-Pad P311.
Feature
Thermal Conductivity: 4.0W/m-K
Good surface wetting property，High insulation
Good mechanical property
Weak viscosity or smooth and non-sticky on surfaceon surface, convenient for automated production
Typical Applications
Battery module and cooling plate heat dissipation
Battery pack
Automotive electronics equipment
Power supply and power conversion equipments
Automotive PTC
Detailed Explanation of Materials
Thermal Performance of Fill-Pad P311
The Fill-Pad P311 has excellent thermal performance with low thermal resistance at low pressures.
Electrical Properties of Fill-Pad P311
Fill-Pad P311 has an average volume resistivity in the order of 10^14 and can withstand a breakdown voltage of 8KV, making it particularly suitable for electrical environments where insulating materials are required.
Reliability of Fill-Pad P311
Fill-Pad P311 has a stable thermal resistance throughout the aging test.Fill-Pad P311 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-Pad P311 can maintain its initial thermal performance without any sign of thermal conductivity decline.
