PTC Thermal Conductivity Solution
Techinno Solution:Fill-Pad P310
The PTC raises the temperature by energizing the thermistor, causing the resistor to heat up, and the heat is quickly conducted away by the thermally conductive interface material.
Feature
Thermal Conductivity: 4.0W/m-K
Good surface wetting property，High insulation
Good mechanical property
Weak viscosity on surface, convenient for automated production
Typical Applications
Battery module and cooling plate heat dissipation
Battery pack
Automotive electronics equipment
Power supply and power conversion equipments
Automotive PTC
Detailed Explanation of Materials
Thermal Performance of Fill-Pad P310
With a thermal conductivity of 4.0 W/m-K, Fill-Pad P310 has a low thermal resistance under low pressure and can be used in a wide range of applications without failing due to pressure and temperature fluctuations.
Electrical Properties of Fill-Pad P310
Fill-Pad P310 has an average volume resistivity in the order of 10^15 and can withstand a breakdown voltage of 11KV, and after 2MPa pressure, the breakdown voltage is still around 10KV. It is especially suitable for electrical environments that require insulating materials.
Reliability of Fill-Pad P310
Fill-Pad P310 has a stable thermal resistance throughout the aging test.Fill-Pad P310 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST, Fill-Pad P310 can maintain its initial thermal performance without any sign of thermal conductivity decline.
