AI Server Thermal Conductivity Solution
Techinno Solution:Fill-LM SW8000
For liquid-cooled data center servers, Techinno has developed a compatible thermal interface material, Liquid Metal Thermal Conductivity Sheet Fill-LM SW8000, to help accelerate the thermal conductivity efficiency of chips in data center servers in submerged environments.
Feature
Extremely high thermal conductivity
Ultra low thermal resistance
High reliability, non-volatile
High temperature tolerance
Compatible with all coolants in immersed environments
Typical Applications
CPU, GPU and other chip-set
LED, laser and other optical devices
Servers, liquid-cooled data center
Aerospace, military radar TR components
Test sorting
Automotive Electronics
Detailed Explanation of Materials
Thermal Performance of SW8000
Fill-LM SW8000 has good thermal performance, the unique sandwich structure can avoid liquid metal leakage while improving the wettability of the interface, fully fill the gap between the heat source and the heat sink to achieve high performance thermal conductivity.
Applicability of FiII-LM SW8000
Techinno Labs tested the FiII-LM SW8000 against the FIL-LM S7200 under the same conditions: 50psi, 80°C for 15 minutes, and the FiI-LMSW8000 showed significant porting at the edges after the phase change, while the FiII-LM SW8000 did not show any porting after the phase change.
Reliability of FiII-LM SW8000
Fill-LM SW8000 performs consistently in a cooling oil and fluorinated fluid 100°C heat source and 60pm simulated diffuse liquid cooling environment with no change in appearance.
