IB Switch Thermal Conductivity Solution
Techinno Solution: Fill-Pad US1400
The power of IB switch increases rapidly with the continuous development of AI big model. In addition to the main control chip and CPU, the heat generation of SSD, DDR, power supply module and other components are also increasing. Fill-Pad US1400 has ultra-high thermal conductivity to satisfy the thermal conductivity needs of the components at each place of the IB switch.
Feature
Thermal Conductivity: 14.0W/m-K
Good surface wetting property
High insulation
Low oil bleeding
Low volatility
No need for fiberglass reinforcement
Typical Applications
IB Switches
5G communication base stations, wireless infrastructure, optical modules
LCD, PDP and laser TV displays
Industrial, LED lighting and power modules
Automotive electronics
Detailed Explanation of Materials
Thermal Performance of Fill-Pad US1400
US1400 is an insulating thermal conductive gap pad with ultra-high thermal conductivity. The high thermal conductivity and soft surface ensure that heat is efficiently transferred to the heat sink.
Oil Bleeding Test of Fill-Pad US1400
The US1400 has low oil bleeding characteristics that effectively minimize possible contamination of circuit boards.
Reliability of Fill-Pad US1400
Fill-Pad US1400 has a stable thermal resistance throughout the aging test. Fill-Pad US1400 has stable thermal resistance performance throughout the reliability test. Under the high temperature aging test, thermal shock test and HAST,Fill-Pad US1400 can maintain its initial thermal performance without any sign of thermal conductivity decline.
