The explosive growth of artificial intelligence technology is reshaping the underlying logic of global digital infrastructure. As the core transmission carrier of data centers and communication networks, the optical module industry is standing at the "eye of the storm" of the AI computing power revolution. At present, the optical module industry is at a crucial stage of "evolving from 400G to 800G and reserving 1.6T technology". Driven by the demand for training large AI models, 800G optical modules have become the main force in the market.

In the previous issue, we introduced high-performance heat conduction solutions within optical modules. This issue will continue to delve into the thermal management of optical modules and take you through heat conduction solutions outside optical modules.

As can be seen from the following figure, in the narrow space of the optical module, it is difficult for thermal convection to achieve a large amount of heat dissipation. The vast majority of the heat inside the optical module is conducted through heat conduction. The heat of the photoelectric chip is conducted to the heat sink block of the shell through the heat-conducting material, and then conducted to the heat dissipation fins outside the shell and dissipated through thermal convection.

To dissipate heat through conduction, it is necessary to reduce thermal resistance, including both internal and external thermal resistance of the optical module, and build a complete heat conduction path from the photoelectric chip to the heat dissipation environment. As mentioned in the previous issue, our Fill-CIP 1120 enables the solution to the thermal management problem within optical modules. Therefore, to address the high heat flux density environment of repeated external plugging and unplugging of high-power optical modules, it is urgently necessary to build the next-generation external heat conduction solution for modules to achieve sufficient heat conduction and ensure the reliability of long-term operation of optical modules.

The T-Plug 800S thermal conductive composite material of Tegeno is equipped with an innovative high-performance thermal conductive phase change material on the carrier. It can be adhered to the inner side of the optical cage or the surface of the plug-in part of the optical module, minimizing the interfacial thermal resistance and providing excellent plug-in performance, significantly increasing the number of plug-in times. It is especially suitable for applications such as heat dissipation of removable and plug-in optical modules.

Product features of T-Plug 800S

1.Excellent durability

The high-strength and high-toughness film extends beyond the thermal conductive phase change material, protecting the PCM located beneath the film. Verified by the Tegino Laboratory, it can easily withstand over 500 repeated insertions and withdrawals, demonstrating outstanding wear resistance and durability, and enhancing overall performance and lifespan.

2.Outstanding reliability

The thermal phase change material is adhered to the surface of the thermal interface of the optical module through PSA around the film, which can prevent the material from being scraped off during the insertion and extraction process. Therefore, it can cope with the application scenarios of repeated insertion and extraction of optical modules and provide excellent reliability.

3. Lower thermal resistance

Compared with the heat conduction between metals, after the phase change, the paste of T-Plug 800S can fill the tiny gaps more fully and expel the air, thereby effectively reducing the thermal resistance and improving the heat dissipation efficiency.