With the rapid popularization and application of AI and large model technologies, the demand for computing power has risen sharply, and the demand for high-speed interconnection in data centers and servers has grown exponentially. As the core hub ensuring efficient network connections and data transmission, switches need to handle massive data traffic for long periods of time.

Under such a high-load working condition, components like the chipset and power module will operate at a high intensity continuously, generating additional heat. Board-level components are the "source" of heat for the switch and also the "core lifeline" for the stable operation of the equipment. Therefore, solving the overheating problem of the switch depends on whether these key components can be effectively cooled down.

Heat dissipation pain points of switch board-level components 

1. The heat source is concentrated and the power consumption density is high.
2. The space is compact and the heat dissipation path is restricted.
3. High stability is required and long-term reliability is needed.
4. Electrical safety of components needs to be compatible.

The heat dissipation requirements for the board-level components of a switch, that is, "in a compact space, for concentrated and high-density heat sources, through efficient, stable and safe heat dissipation paths to ensure the long-term reliable operation of the components", only when the source temperature is controllable can the switch work normally and the heat conduction solution truly play its role.

Techinno Fill-Pad US1400 has become one of the key disruptors in the heat dissipation of switch board components.

Ultra-high thermal conductivity
The thermal conductivity is as high as 14.0W/m-K, which can quickly transfer heat. It has good surface wettability, which can significantly reduce thermal resistance and maintain the efficient operation performance of the switch.

Excellent mechanical properties
The Fill-Pad US1400 features high compressive set and low compressive stress, achieving high deformation under lower pressure and having low residual stress.

Low-permeability oil
If the grease component of the thermal conductive gasket precipitates seriously, it will contaminate the internal environment of the switch and even affect its normal operation. The Tegino Fill-Pad US1400 gasket has the characteristic of low oil seepage. The special matrix and powder work together to bind small molecules and free oil bodies, limit their migration and seepage space, thereby effectively reducing oil seepage and ensuring the stable operation of equipment.

High reliability
The thermal resistance performance of Tegino Fill-Pad US1400 remained stable throughout the reliability test process. Under the conditions of continuous high temperature, high and low temperature shock, and double 85 tests, it did not fail due to fluctuations in pressure and temperature, and always maintained stable thermal conductivity.

In this era where computing power equals productivity, thermal management technology has become an invisible engine for technological development. Techinno continuously innovates and deepens applications, providing more efficient and reliable solutions to facilitate the arrival of the computing power era.