About Us
Techinno Technology was founded in 2018, with a total plant area of more than 6,000 square meters and a total investment of more than 50 million yuan, around the electronic product chip level, system level, board level and device level functional requirements to provide the overall solution of electronic materials, focusing on the research and development, manufacturing and sales of high-end thermally conductive interface materials (TIM1, TIM1.5 & TIM2), to provide customers with integrated solutions!
Founded
+
Total plant area(m²)
+
Investment(million yuan)
Domain Controller Thermal Solution
Electric Vehicle Motor Controller Thermal Conductivity Solutions
Thermal Conductivity Solutions for Electric Vehicle Air Conditioning Compressor Controllers
Lidar Thermal Solutions
AI Server Thermal Conductivity Solutions
VR Thermal Conductivity Solutions
Thermal Conductivity Solutions for UAVs
Domain Controller Thermal Solution
Electric Vehicle Motor Controller Thermal Conductivity Solutions
Thermal Conductivity Solutions for Electric Vehicle Air Conditioning Compressor Controllers
Lidar Thermal Solutions
AI Server Thermal Conductivity Solutions
VR Thermal Conductivity Solutions
Thermal Conductivity Solutions for UAVs
News Information
-
As a key pioneering field of smart vehicles, the intelligent cockpit has evolved with the integration of automotive electronic and electrical architecture, and gradually formed the cockpit domain controller program, where the control and computing of software and hardware are concentrated on the same SoC chip. The single chip is integrated with various modules such as CPU, GPU, RAM, ADC/DAC, Modem, high-speed DSP, and is capable of supporting high-performance computing, graphical computing, Al computing, audio processing and etc. The high concentration of computing makes the heat generation of chip become larger, while the hardware integration also leads to further optimization and upgrading of the domain control structure, resulting in a shrinking space for the thermal conduction, with gaps as low as 0.2mm or be...
-
As a key pioneering field of smart vehicles, the intelligent cockpit has evolved with the integration of automotive electronic and electrical architecture, and gradually formed the cockpit domain controller program, where the control and computing of software and hardware are concentrated on the same SoC chip. The single chip is integrated with various modules such as CPU, GPU, RAM, ADC/DAC, Modem, high-speed DSP, and is capable of supporting high-performance computing, graphical computing, Al computing, audio processing and etc. The high concentration of computing makes the heat generation of chip become larger, while the hardware integration also leads to further optimization and upgrading of the domain control structure, resulting in a shrinking space for the thermal conduction, with gaps as low as 0.2mm or be...
