About Us

Techinno Technology was founded in 2018, with a total plant area of more than 6,000 square meters and a total investment of more than 50 million yuan, around the electronic product chip level, system level, board level and device level functional requirements to provide the overall solution of electronic materials, focusing on the research and development, manufacturing and sales of high-end thermally conductive interface materials (TIM1, TIM1.5 & TIM2), to provide customers with integrated solutions!

2018

Founded

6000

 +

Total plant area(m²)

5000

 +

Investment(million yuan)

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Techinno Product

Fill-Pad Series

Fill-PT Series

Fill-Grease Series

Fill-PCM Series

Fill-Gel Series

Fill-CIP Series

T-Mask Series

Fill-LM Series

Fill-Bond Series

Fill-ESM Series

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Domain Controller Thermal Solution

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Electric Vehicle Motor Controller Thermal Conductivity Solutions

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Thermal Conductivity Solutions for Electric Vehicle Air Conditioning Compressor Controllers

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Lidar Thermal Solutions

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AI Server Thermal Conductivity Solutions

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VR Thermal Conductivity Solutions

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Thermal Conductivity Solutions for UAVs

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Domain Controller Thermal Solution

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Electric Vehicle Motor Controller Thermal Conductivity Solutions

   View More   

Thermal Conductivity Solutions for Electric Vehicle Air Conditioning Compressor Controllers

   View More   

Lidar Thermal Solutions

   View More   

AI Server Thermal Conductivity Solutions

   View More   

VR Thermal Conductivity Solutions

   View More   

Thermal Conductivity Solutions for UAVs

   View More   

News Information

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  • 2023-08-29
    New energy vehicles are entering the HPC era, the huge heat caused by high power puts more stringent requirements on heat dissipation. Especially for the new energy automotive electronic components with increasing integration, under the several waves of intelligence, electrification, networking, and multi-screen, small heating components such as inductors, copper bars, and capacitors have changed in terms of order of magnitude and calorific value....
  • 2023-08-29
    New energy vehicles are entering the HPC era, the huge heat caused by high power puts more stringent requirements on heat dissipation. Especially for the new energy automotive electronic components with increasing integration, under the several waves of intelligence, electrification, networking, and multi-screen, small heating components such as inductors, copper bars, and capacitors have changed in terms of order of magnitude and calorific value....