Driven by rapid AI iteration and surging computing power, data centers enter a high power density era. Highly integrated onboard hardware squeezes CPUs, GPUs, optical modules and other core parts into limited space, bringing great challenges to thermal management.  1. Extreme local heat flux. Dense high-power chips cause accumulated heat, leading to frequency reduction and system downtime. 2. High interfacial thermal resistance. Micro gaps between components form air barriers and weaken heat dissipation.  3. Hidden reliability risks. Precision parts are vulnerable to pressure damage. Thermal materials need low outgassing, silicone-free property and stable performance under high temperature. Techinno Fill-Pad US1600 Silicone-free Thermal Pad Techinno officially launches the Fill-Pad US 1600 high-performance silicone-free thermal pad, which is tailor...

Techinno Pluggable TIM T-Plug 820S is released, helping to upgrade the thermal management of optical modules!

On October 29, 2025, the 2025 (4th) Global Conference on Innovation, Development and Application Technology of Liquid Cooling Systems for Data Centers grandly kicked off in Hangzhou. As a highly influential technical exchange platform in the industry, this conference brings together renowned experts, representatives of pioneering enterprises and top research institutions in the industry, focusing on core topics such as liquid cooling technology innovation and breakthroughs in chip-level heat dissipation, to jointly discuss the efficient development path of data centers in the era of computing power. Techinno was invited to attend the conference and won the "2025 Golden Scale Award - Liquid Cooling Materials Innovation Award", becoming one of the highlights of the conference that attracted much attention. Won the 2025 Golden Scale Award for Liquid Cooling Ma...

With the accelerated penetration of AI, big data and 5G technologies, automobiles are moving towards an era of intelligence and autonomous driving, which is driving the evolution of electronic and electrical architectures from distributed ECUs to centralized domain control and even central computing.   The highly integrated architecture forces the performance upgrade of the chip - to handle the massive data from multiple sensors and support complex autonomous driving algorithms, the power consumption and heat flux density of the high-performance chips equipped in the intelligent driving domain control have significantly increased, directly leading to a substantial rise in their heat generation. Heat dissipation challenges of intelligent driving domain control The thermal management issue of intelligent driving domain control is becoming one of the key topics that must be o...

With the rapid popularization and application of AI and large model technologies, the demand for computing power has risen sharply, and the demand for high-speed interconnection in data centers and servers has grown exponentially. As the core hub ensuring efficient network connections and data transmission, switches need to handle massive data traffic for long periods of time. Under such a high-load working condition, components like the chipset and power module will operate at a high intensity continuously, generating additional heat. Board-level components are the "source" of heat for the switch and also the "core lifeline" for the stable operation of the equipment. Therefore, solving the overheating problem of the switch depends on whether these key components can be effectively cooled down. Heat dissipation pain points of switch board-level components  1. The heat sourc...

The explosive growth of artificial intelligence technology is reshaping the underlying logic of global digital infrastructure. As the core transmission carrier of data centers and communication networks, the optical module industry is standing at the "eye of the storm" of the AI computing power revolution. At present, the optical module industry is at a crucial stage of "evolving from 400G to 800G and reserving 1.6T technology". Driven by the demand for training large AI models, 800G optical modules have become the main force in the market.   In the previous issue, we introduced high-performance heat conduction solutions within optical modules. This issue will continue to delve into the thermal management of optical modules and take you through heat conduction solutions outside optical modules.   As can be seen from the following figure, in the narrow space of th...